SOLAR INSPECTION SYSTEMS
From silicon to solar modules: Intego offers inspection systems for all production steps
CERAMICS & GLASS INSPECTION SYSTEMS
Inclusions, cracks, geometry measurements: quality control in ceramics and glass production is crucial for flawless parts
PLASTICS INSPECTION SYSTEMS
Automotive or medical engineering: Intego has many years of experience in inspection technologies for plastic products
METAL INSPECTION SYSTEMS
Surface inspection or measurement of grooves: Convince yourself of our solutions
SEMICONDUCTOR INSPECTION SYSTEMS
High throughput detection of surface, material and process defects for bare, epitaxial, patterned and diced wafers More...
ELECTRONIC INSPECTION SYSTEMS
Lock-in thermography shows defects and material properties below the visible surface
The combination of complex camera technology and automation allows new solutions in industrial production
Intego is an innovative medium-sized company located in Erlangen, Germany. Together with our team we develop and manufacture complex inspection systems for our customers worldwide.
Due to high added value in the production steps, it is important to guarantee frictionless operation and to avoid production shutdowns, particulary due to wafer breakage. Therefore, wafers with structural defects, e.g. cracks, saw marks or chippings should be detected and separated out.
Our new technology is independent of the grain structure of multicrystalline wafers. Using illuminations and cameras in the IR spectral range results in the reliable detection of microcracks.
ANTARES crack detection »
Solar wafers are structured with lasers to gain more efficiency. We have extensive experience measuring these structures to control the laser process and make sure that only correctly lasered wafers proceed to the next manufacturing steps.
Providing lateral resolutions as small as 10 µm, the wafer geometry can be determined with high accuracy. Defects such as chippings can therefore be detected easily.
The topography on both sides can be determined with resolutions as small as 1 µm perpendicular to the wafer surface. It is thereby possible to detect small saw marks or chippings in addition to recording statistical data such as thickness or bending.
Knowledge of the grain structure gives valuable information about the crystallization process. With the GEMINI tool the grain structure of each wafer can be characterized offline or inline for classification.
GEMINI grain analysis »
ANTARES – Crack Detection »
GEMINI – Grain Analysis »
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