Semiconductor Inspection

In the semiconductor industry, high standards are required to ensure the faultless quality of the final products. The inspection of the basic substrates and semi-finished products is an important step for precisely characterizing component properties and production processes. Thereby, high reproducibility and absolute accuracy of the measurements are taken into account. Our automated vision systems make a significant contribution to optimizing your quality and efficiency. The measurements are carried out continuously and include live statistics.

The microscope scanner for the inspection of LEDs, OLEDs and MEMS is based on an automated platform, which delivers a high throughput of the parts. The basic system consists of a handling unit and a measuring unit. In the handling unit, a robot transports the wafers or substrates, which can have a diameter of up to 12", out from the cassettes, while in the measuring unit the samples are moved under the detector. Typically, resolutions of 0.1 μm - 5 μm are achieved in combination with illumination techniques from the UV-VIS-IR spectral range.

The crystal growth of semiconductor compounds (SiC, GaAs, etc.) and subsequent processing of the wafers to components is of increasing importance in the semiconductor industry. Despite major improvements in the material quality of substrates and epiwafers, critical defects such as stacking faults (SFs) and basal plane dislocations (BPDs) can lead to complete failure of the components. In this context, a novel photoluminescence scanner for SiC wafers was developed with industrial and academia partners.

• Inspection of LEDs, OLEDs, MEMS
• High throughput, inline process


• Inspection of SiC wafer
• Characterization of crystallographic defects